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Electronic Package

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Iscar Ltd
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Electronic Package
Benefit: Cost Saving, Improved Performance, Increased Component Complexity
Main Forming Process: Conventional Processing
End Use Sector: Defence
Material: Ferrous


The part is moulded from a composition designated as F15 (Ni-Co-Fe); tolerances on the holes is +/- 0.02mm. This MIM part is used in Opto-Electonics Packages, and one of the requirements is that the material should have a dilation curve similar to that of the glass used to seal the connection.

A critical factor for the customer is that the MIM electronic box is tested to check hermeticity after the part has been subjected to temperature shocks. The part replaces a similar one made by machining and brazing which as a process was much more expensive than MIM.

Component Specification

Weight (g): 10
Density (g/cm3): 8.00

The information contained in these case studies is provided by third parties and although EPMA does its best to ensure the case studies are accurate it is not liable for any mistakes or wrong information

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